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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Original price was: ₨ 2,000.₨ 1,500Current price is: ₨ 1,500.
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